Surface Mount Technology

Surface Mount Technology

Surface Mount Technology involves precision screen printing of solder paste and adhesive, highly accurate component placement, and carefully controlled reflow conditions. Our capabilities in these areas are truly exceptional. All our machines have the most advanced Vision Recognition Technology to achieve the level of accuracy and repeatability required of the most demanding applications.
Again Visual Recognition Technology is employed to screen bad parts (mis-aligned leads, etc) and achieve the level of accuracy required for placement of small components like 0603 and 0402's, fine and ultra-fine pitch components, and Area Array components like BGA's.

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Screen Printing

Boards are printed to an accuracy of +/-25 microns. Boards of up to 510 by 508 mm can be printed. Both water soluble and no-clean solder paste are used. Single and multilevel stencils are used to achieve optimum volume of solder deposit on pads. Rigid PWB's, Felexible Circuit Boards, and thin boards (PCMCIA cards) are all printed with utmost precision and repeatability.

Component Placement

The full spectrum of SMT components are placed: Chips, SOT, DPAK, SOD, SOJ, SOP, SSOP, TSOP, TSSOP, QSOP, MELF, MINI-MELF, SOIC, LCC, PLCC, UTQFP, TQFP, BQFP, QFP, PQFP, Tant, CAPS, Al. Elec. CAPS, Variable CAPS, Inductors, Crystals, Resistor Assays, BGA, PBGA, CGA, Surface Mount Connectors and Sockets, SMT LED, Odd Form SMT's etc.
Specifically, components are placed with an accuracy of +/-60 micro m, pitches as low as 0.4mm, on boards up to 460 X 500 mm.

Reflow

Boards are reflowed in air or N2 atmosphere depending on board and customer requirements. Temperature profiles are taken to ensure optimum reflow conditions every time and on every pad. Profiles are logged and filed for future reference.